About the Consortium
The goal of the Hybrid Memory Cube Consortium is to facilitate HMC Integration into a wide variety of systems, platforms and applications by defining an adoptable industry-wide interface that enables developers, manufacturers and enablers to leverage this revolutionary technology.
How to Get Involved
The HMCC is open to an unlimited number of adopters who can apply for access to the HMC Specification and participate in the specification review, discussion and development.
- To receive an executable Adopter Agreement fill out and submit an Application.
Have questions about the HMCC or becoming an Adopter? Contact Us
HMC Consortium Participants
Founded by Micron Technology and Samsung Electronics Co. Ltd., the Hybrid Memory Cube Consortium is managed by a group of eight developers, each of whom has equal voice and voting power on the final specification. This group is responsible for managing the organization, attending management and adoption meetings, and developing and optimizing the ongoing HMC interface specification.
Developer Members:
Adopter Members:
- Accel, Ltd.
- Achronix Semiconductor Corporation
- Adaptive Array Systems Limited
- ADATA Technology Co., Ltd.
- AIRBUS
- Alchip Technologies Ltd.
- Altior
- Analog Bits
- APIC Corporation
- Arira Design
- Arnold & Richter Cine Technik
- Asic Research Inc.
- Atria Logic, Inc.
- Avago Technologies U.S. Inc.
- Avery Design Systems
- Bayside Design Inc.
- BroadPak Corporation
- Brocade Communications Systems, Inc.
- Cadence Design Systems, Inc.
- Calnex Solutions Ltd.
- Cascade Microtech
- Compass-EOS
- Convey Computer Corporation
- Cray Inc.
- DAVE Srl
- Design Magnitude Inc.
- DFC Design, s.r.o.
- Dream Chip Technologies GmbH
- eASIC
- Engineering Physics Center of MSU
- Esencia Technologies Inc.
- eSilicon Corporation
- Exablade Corporation
- EZchip Semiconductor Ltd.
- FirstPass Engineering
- FormFactor, Inc.
- Fujitsu Advanced Technologies Ltd.
- Galaxy Computer System Co., Ltd.
- GDA Technologies
- GiDEL
- Global Unichip Corp
- GLOBALFOUNDRIES
- Google Inc.
- GraphStream Incorporated
- Green Wave Systems Inc.
- HGST, a Western Digital Company
- HiSilicon Technologies Co., Ltd.
- HiTech Global
- HOY Technologies
- Huawei Technologies
- Industrial Technology Research Institute (ITRI
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- ROHDE & SCHWARZ GmbH & Co. KG
- S2C Inc.
- S3Craft Technologies
- Science & Technology Innovations
- SEAKR Engineering
- Semtech Corporation - Snowbush IP
- Signal Integrity Software, Inc.(SiSoft)
- SIMMTECH Co., Ltd.
- Sintecs BV
- SKA South Africa
- Smart Modular Technologies, Inc.
- Socionext, Inc.
- Somerset Technology Services, Inc.
- STMicroelectronics
- Suitcase TV Ltd.
- Sundance DSP, Inc.
- Suzhou Powercore Technology Co. Ltd.
- Synopsys Inc.
- Synthetic Intelligence
- T-Platforms
- Tabula
- Tactical Computing Laboratories
- Tech-Trek Ltd.
- Technion - Israel Institute of Technology
- Technische Universitaet Braunschweig (Abteilung Technische Informatik, E.I.S.)
- Technische Universität Dresden, HPSN
- Technolution B.V.
- TekStart LLC
- Tektronix, Inc.
- Teledyne LeCroy
- Teradyne, Inc
- Telesoft Technologies Ltd
- The Regents of the University of California
- Tilera Corporation
- Tipalo GmbH
- Tongji University
- Truechip Solutions Pvt. Ltd.
- TU Kaiserslautern, Lehrstuhl Entwurf Mikroelektronischer Systeme
- UC Irvine
- United Microelectronics Corporation
- Università di Bologna - DEI
- University of Heidelberg ZITI
(Center for Computer Engineering
- University of Rochester
- University of Southern California
- Wave Semiconductor
- Winbond Electronics Corporation
- Woodward McCoach, Inc.
- Wuhan Integrated Circuit Center
- ZTE Corporation
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